Substrate storage container management system, load port, and substrate storage container management method

ABSTRACT

A substrate storage container management system includes a load port, configured to transfer a substrate into and out of one or more substrate storage containers, including an ID reader configured to read one or more entity IDs for the substrate storage containers, and one or more sensors configured to directly or indirectly detect one or more states of the substrate storage containers, an associator configured to associate the entity IDs read by the ID reader with one or more sensor values detected by the sensors; a database in which data associated by the associator is accumulated, and a data processor configured to analyze the data in the database and to output a state of a respective substrate storage container for each of the entity IDs.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2018-099494, filed on May 24, 2018, andJapanese Patent Application No. 2019-031789, filed on Feb. 25, 2019, theentire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a substrate storage containermanagement system for managing deterioration information of a container(substrate storage container) capable of storing wafers, a load portapplicable to the substrate storage container management system, and asubstrate storage container management method.

BACKGROUND

In a semiconductor manufacturing process, wafers are processed in aclean room in order to improve the yield and the quality. In recentyears, a “mini-environment method” for improving a degree of cleanlinessonly in a local space around a wafer is adopted, and a means forperforming wafer transfer and other processes is employed. In themini-environment method, a load port, which constitutes a part of a wallsurface of a substantially-closed wafer transfer chamber (hereinafterreferred to as “transfer chamber”) in a housing, holds an FOUP(Front-Opening Unified Pod) as a container for storing wafers in ahighly clean internal space, and has a function of opening and closing adoor of the FOUP (hereinafter referred to as “FOUP door”) while makingclose contact with the FOUP door, and the load port is provided adjacentthe transfer chamber.

The load port is a device for loading and unloading wafers to and fromthe transfer chamber, and functions as an interface between the transferchamber and the FOUP. Then, when a door of the load port (hereinafterreferred to as “load port door”) which can engage with the FOUP door toopen and close the FOUP door is opened, the wafer stored in the FOUP canbe taken out into the transfer chamber, or the wafer can be stored inthe FOUP from the transfer chamber by a transfer robot (wafer transferdevice) disposed in the transfer chamber.

In a semiconductor manufacturing process, in order to properly maintainan atmosphere around wafers, a storage pod called a FOUP as describedabove is used to store and manage the wafers inside the FOUP.Particularly, in recent years, high integration of elements andminiaturization of circuits have been promoted. The surroundings of awafer are required to be kept at a high degree of cleanliness so thatparticles and moisture do not adhere to a wafer surface. Therefore, inorder to prevent a change in the properties of the wafer surface such asoxidization of the wafer surface or the like, a process (purge process)is also performed in which the inside of the FOUP is filled with anitrogen gas so as to keep the surroundings of the wafer in a nitrogenatmosphere which is an inert gas, or in which the inside of the FOUP iskept in a vacuum state.

Since dust and impurities used in a process stay inside the FOUP, theFOUP is periodically cleaned with hot water and reused. By repeating thehot water cleaning, the resin-made FOUP is gradually deformed. Since theairtightness is reduced due to such deformation of the FOUP, there isposed a problem of inflow or leakage of a gas to or from the FOUP. Forexample, when distortion occurs in a loading/unloading port of an FOUPbody that can be opened and closed by the FOUP door, the airtightnessprovided by the FOUP door is reduced. As a result, after carrying out apurge process to replace the gas in the FOUP with a nitrogen gas, thenitrogen gas in the FOUP may leak out of the FOUP during the transfer byan OHT or the like, and the ambient air may easily flow into the FOUP.This poses a problem where the oxygen concentration in the FOUPincreases.

In order to address such a problem, it may be considered to adopt amethod of determining a degree of deterioration of an FOUP by measuringthe shape of the FOUP for each FOUP (hereinafter referred to as “theformer method”) or a method of uniformly replacing FOUPs that have beenused over a predetermined number of use times or over a predetermineduse period (hereinafter referred to as “the latter method”).

However, in the former method, it is necessary to measure the shape ofthe FOUP one by one. Therefore, the time to carry out such shapemeasurement should be secured at an appropriate timing during asemiconductor manufacturing process or before or after the semiconductormanufacturing process. This is time-consuming and inefficient. In thelatter method, the FOUP which has not deteriorated to such an extent asto be replaced may be replaced, and the cost required for the newpurchase of a FOUP may increase more than necessary. Furthermore, theFOUP which has a large degree of deformation before reaching apredetermined number of use times or a predetermined use period may becontinuously used until reaching the predetermined number of use timesor the predetermined use period, and the inflow or leakage to or fromthe FOUP may occur.

Since the FOUP deformation progresses little by little, it is difficultto accurately grasp the replacement time due to deterioration for eachFOUP. A replacement method such as the latter method or the like thatignores individual differences in FOUP is inefficient and may generateunnecessary replacement costs. There is no high probability that theinflow or leakage of a gas to or from the FOUP can be prevented inadvance.

Thus, there has been proposed a management system including a detectionmeans provided in a substrate storage container to detect its use state,a compact wireless communication means provided in the substrate storagecontainer to determine an inspection check time, an inspection checkdevice for inspecting and checking the substrate storage container atthe inspection check time, and a notification means for notifying thecontents according to any one of the determination result of theinspection check time of the substrate storage container by the wirelesscommunication means and the inspection check result of the substratestorage container by the inspection check device, wherein the wirelesscommunication means compares at least a detected value of the detectionmeans with an inspection check value of the substrate storage containerusing an arithmetic processing part, and determines the inspection checktime of the substrate storage container based on the comparison result(see Patent Document 1).

Patent Document 1 describes as follows. According to such a managementsystem, the use condition of the substrate storage container is detectedby the detection means provided in the substrate storage container. Thedetected value and the threshold value regarding the substrate storagecontainer are compared in the wireless communication means which is anoutput destination of the detected value. As a result, if the detectedvalue is smaller than the threshold value or is not close to thethreshold value, it is determined that the substrate storage containercan be used as it is. If the detected value is close to the thresholdvalue or is larger than the threshold value, it is determined that theperformance or the quality of the substrate storage container isdeteriorated and that the use limit of the substrate storage containeris near. This makes it possible to select a replacement product for thesubstrate storage container.

PRIOR ART DOCUMENTS Patent Documents

-   Patent Document 1: Japanese Patent Application Publication No.    2017-212322

However, in the case of the management system described in PatentDocument 1, it is essential to provide the sensor and the communicator(hereinafter referred to as “instruments such as a sensor and the like”)in the FOUP which is a substrate storage container. Therefore, inaddition to the need for an operation of mounting the instruments suchas a sensor and the like, it is also required to mount a sensor powersupply for each FOUP. Accordingly, in order to realize the systemdescribed in Patent Document 1, it is necessary to replace all the FOUPswith new FOUPs because the general FOUPs currently used as substratestorage containers cannot be used. In a semiconductor manufacturingline, a large number of FOUPs are already widely used. It is burdensomefor the user to adopt the management system of Patent Document 1 byreplacing all the FOUPs. It is considered that it is difficult tointroduce the management system into a manufacturing site.

Furthermore, the following problems may be posed. The task ofindividually maintaining the instruments such as a sensor and the likemounted on a large number of FOUPs requires a lot of labor. It is alsorequired to pay attention to the failure of the instruments such as asensor and the like caused by the heat or water when cleaning FOUPs withhot water. It is difficult to thoroughly perform advance preparation ormaintenance for using instruments such as a sensor and the like in anormal state. If the advance preparation or maintenance of theinstruments such as a sensor and the like is insufficient, an accuratedetection process cannot be performed by a sensor, an unstable wirelesscommunication state may occur, and the FOUPs to be replaced cannot beappropriately selected. The use of a FOUP, which would otherwise be atarget of replacement, may cause inflow or leakage of a gas to or fromthe FOUP. The surfaces of the wafers in the FOUP may be oxidized. Suchproblems may similarly occur in substrate storage containers other thanan FOUP.

SUMMARY

The present disclosure has been made in view of such problems. It is anmain object of the present disclosure to realize, by using a currentlygenerally used FOUP instead of an FOUP provided with instruments such asa sensor and the like, a substrate storage container management systemcapable of predicting a replacement timing of a substrate storagecontainer, which undergoes deterioration attributable to the use thereofand the like, in order to suppress oxidation of the surfaces of wafersstored in a substrate storage container such as an FOUP or the like. Inaddition, the present disclosure describes a technique capable offinding its application even in substrate storage containers other thanan FOUP.

A substrate storage container management system according to the presentdisclosure includes: a load port that is configured to transfer asubstrate into and out of one or more substrate storage containers, andincludes: an ID (identification) reader configured to read one or moreentity IDs for the one or more substrate storage containers; and one ormore sensors configured to directly or indirectly detect one or morestates of the one or more substrate storage containers; an associatorconfigured to associate the one or more entity IDs read by the ID readerwith one or more sensor values detected by the one or more sensors; adatabase in which data associated by the associator is accumulated; anda data processor configured to analyze the data in the database and tooutput a state of a respective substrate storage container for each ofthe one or more entity IDs.

In this regard, the entity identification (ID) is used to specify eachsubstrate storage container and may be used to determine from whichsubstrate storage container the detected value of the sensor provided atthe load port is obtained. In addition, the data regarding thetime-dependent deterioration of the substrate storage container and thelike is not written into the entity identification (ID). The “sensorconfigured to directly or indirectly detect a state of the substratestorage container” may be any sensor capable of detecting informationwhich indicates deterioration (deformation) of the substrate storagecontainer. Examples of the sensor may include a sensor for detecting thepressure of a gas (exhaust gas) exhausted from the inside of thesubstrate storage container to the outside of the substrate storagecontainer through a port of the substrate storage container at the timeof a purge process for replacing the inside of through substrate storagecontainer with a suitable gas such as a nitrogen gas or the like and amapping sensor for detecting a substrate position in the substratestorage container. The deformation of the substrate storage containercan be grasped from the pressure sensor value of the exhaust gas or thedetected value of the mapping sensor. That is to say, when the pressuresensor value of the exhaust gas is lower than before, it may beconsidered that the substrate storage container is deformed and the gasin the substrate storage container is leaked to the outside through thedeformed portion of the substrate storage container during the purgeprocess. In addition, when the detected value of the mapping sensor isdifferent from the previous detection value (when substrate displacementhas occurred), it may be considered that the substrate storage containeris deformed and the position of the substrate is changed. That is tosay, the substrates stored in the substrate storage container are placedon a multistage shelf provided in the substrate storage container. Thegap between the substrates in the height direction is changed as thedeformation of the substrate storage container progresses. Therefore, bydetecting such a change, it is possible to determine whether or not thesubstrate storage container is deformed. Furthermore, by detectingwhether or not one substrate is inclined, it is possible to determinewhether or not the substrate storage container is deformed.

With such a substrate storage container management system according tothe present disclosure, it is not necessary to mount a sensor powersource on each substrate storage container. The task of assigning entityidentifications (IDs) to all the substrate storage containers is easierthan the task of providing instruments such as a sensor and the like inall the substrate storage containers. Furthermore, the power supply tothe ID reader and the sensor of the load port can be performedrelatively easily using the electrical system of the load port. Inaddition, the substrate storage container management system according tothe present embodiment is advantageous in that, by setting theinstallation target of the sensor to the load port, as compared with anembodiment in which the instruments such as a sensor and the like areprovided for each substrate storage container as described as the priorart, it is possible to reduce the absolute number of instrumentssubjected to maintenance and to alleviate the burden of maintenance andit is not necessary to pay attention to the failure of instruments suchas a sensor and the like caused by the heat or water intrusion at thetime of cleaning the substrate storage container with hot water.

Furthermore, according to the substrate storage container managementsystem of the present disclosure, the entity identification (ID)assigned to the substrate storage container already used in manymanufacturing sites and the detected value obtained by the sensorprovided in the load port are associated to create a database, the datain the database is analyzed by the data processor, and the state of thesubstrate storage container for each entity identification (ID) isoutputted, whereby deterioration information of the substrate storagecontainer can be acquired and grasped. By utilizing the substratestorage container management system according to the present disclosure,it is possible to specify the replacement time of each substrate storagecontainer based on the deterioration information. By replacing thesubstrate storage container to be replaced with a new substrate storagecontainer, it is possible to prevent or suppress a situation that thesurfaces of the substrates accommodated in the substrate storagecontainer are oxidized due to the deformation of the substrate storagecontainer. This makes it possible to reduce the frequency of occurrenceof errors. Thus, the down time of the semiconductor manufacturingapparatus is shortened, and the productivity is improved.

In the present disclosure, the data processor may include: a calculatorconfigured to calculate statistical data from one or more sensor valuesdetected by a specific sensor of the one or more sensors; a comparatorconfigured to compare a sensor value associated with a specific entityID of the one or more entity IDs for a specific substrate storagecontainer with a calculation result obtained by the calculator; and astate output part configured to output a state of the specific substratestorage container based on a comparison result obtained by thecomparator.

By providing the calculator and the comparator in the data processor, itis possible to make versatile the data processing in the data processor.

In the present disclosure, the one or more sensors of the load port mayinclude plural types of sensors, and the associator may be configured toassociate the one or more entity IDs with plural types of sensor valuesdetected by the plural types of sensors.

According to such a configuration, the state of the substrate storagecontainer can be determined using plural types of sensor values. It istherefore possible to enhance the accuracy of determination.

In the present disclosure, the system may further include an operationadjuster configured to adjust a control value associated with processingof the respective substrate storage container at the load port based onthe state of the respective substrate storage container for each of theone or more entity IDs that is outputted by the data processor.

By providing such an operation adjuster, the processing on the substratestorage container performed at the load port can be adjusted accordingto the state of the substrate storage container. It is thereforepossible to suppress generation of an error at the load port and toperform smooth processing.

In the present disclosure, the associator may be configured to associatethe one or more entity IDs with at least one of error information thatis generated during processing of the respective substrate storagecontainer and process information on processing of the substrate storedin the respective substrate storage container, and the substrate storagecontainer management system may further include an operation adjusterconfigured to adjust a control value associated with the processing ofthe respective substrate storage container at the load port based on theat least one of the error information and the process information foreach of the one or more entity IDs that is accumulated in the database.

By providing such an operation adjuster, the processing on the substratestorage container performed at the load port can be adjusted accordingto the error generated in advance or the processing performed on thesubstrate. It is therefore possible to suppress generation of an errorat the load port and to perform smooth processing.

In the present disclosure, the system may further include a host systemconfigured to communicate with the load port, and at least theassociator, the database, and the data processor may be provided in thehost system.

By providing such a host system separately from the load port, it ispossible for the host system to process the data acquired at a pluralityof load ports.

In the present disclosure, the data processor may include a learningpart configured to learn the one or more states of the one or moresubstrate storage containers from the one or more sensor values detectedby the one or more sensors.

By providing such a learning part, it is possible to estimate the stateof the substrate storage container with high accuracy.

A load port for transferring a substrate into and out of one or moresubstrate storage containers, according to the present disclosure,includes an ID reader configured to read one or more entity IDs for theone or more substrate storage containers; and one or more sensorsconfigured to directly or indirectly detect one or more states of theone or more substrate storage containers, wherein the load port isemployed in a substrate storage container management system including:an associator configured to associate the one or more entity IDs read bythe ID reader with one or more sensor values detected by the one or moresensors; a database in which data associated by the associator isaccumulated; and a data processor configured to analyze the data in thedatabase and to output a state of a respective substrate storagecontainer for each of the one or more entity IDs.

According to such a load port, as described above, it is possible toacquire the sensor value related to the management of the substratestorage container and to appropriately manage the substrate storagecontainer.

A substrate storage container management method according to the presentdisclosure includes: reading, by a load port configured to transfer asubstrate into and out of one or more substrate storage containers, oneor more entity IDs for the one or more substrate storage containers;detecting, by one or more sensors provided at the load port, one or morestates of the one or more substrate storage containers, directly orindirectly; associating the one or more entity IDs with one or moresensor values that are detected in the act of detecting the one or morestates; accumulating data associated in the act of associating the oneor more entity IDs in a database; and analyzing the data in the databaseand outputting a state of a respective substrate storage container foreach of the one or more entity IDs.

With such a substrate storage container management method according tothe present disclosure, the state of each substrate storage containercan be outputted by using the substrate storage containers already usedin many manufacturing sites as they are without significantly changingthe specifications. Then, it is possible to predict the replacement timeof each substrate storage container based on the output information onthe state of the substrate storage container.

In the present disclosure, the method may further include adjusting acontrol value associated with processing of the respective substratestorage container at the load port based on the state of the respectivesubstrate storage container for each of the one or more entity IDs thatis outputted in the act of outputting the state.

By providing such an operation adjustment step, the processing on thesubstrate storage container performed at the load port can be adjustedaccording to the state of the substrate storage container. It istherefore possible to suppress generation of an error at the load portand to perform smooth processing.

In the present disclosure, in the act of associating the one or moreentity IDs, the one or more entity IDs may be associated with at leastone of error information that is generated during processing of therespective substrate storage container and process information onprocessing of the substrate stored in the respective substrate storagecontainer, and the method may further include adjusting a control valueassociated with the processing of the respective substrate storagecontainer at the load port based on the at least one of the errorinformation and the process information for each of the one or moreentity IDs that is accumulated in the database.

By providing such an operation adjustment step, the processing on thesubstrate storage container performed at the load port can be adjustedaccording to the error generated in advance or the processing performedon the substrate. It is therefore possible to suppress generation of anerror at the load port and to perform smooth processing.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the presentdisclosure, and together with the general description given above andthe detailed description of the embodiments given below, serve toexplain the principles of the present disclosure.

FIG. 1 is a block diagram of a substrate storage container managementsystem according to a first embodiment of the present disclosure.

FIG. 2 is a side view schematically showing the relative positionalrelationship between an EFEM and its peripheral devices according to thefirst embodiment.

FIG. 3 is a view schematically showing a side cross section of a loadport according to the first embodiment in which an FOUP is spaced apartfrom a base and a load port door is in a fully closed position.

FIG. 4 is a perspective view showing a load port according to the firstembodiment with a portion thereof omitted.

FIG. 5 is a view in the direction of an arrow x in FIG. 4.

FIG. 6 is a view in the direction of an arrow y in FIG. 4.

FIG. 7 is an overall perspective view of a window unit according to thefirst embodiment.

FIG. 8 is a view corresponding to FIG. 3 and showing a state in whichthe FOUP is close to the base and the load port door is in the fullyclosed position.

FIG. 9 is a view corresponding to FIG. 3 and showing a state in whichthe load port door is in an open position.

FIG. 10 is a view showing a mapping part according to the firstembodiment.

FIGS. 11A and 11B are a functional block diagram and a flowchart of adata processor according to the first embodiment.

FIGS. 12A to 12D are views schematically showing processing contents inthe data processor according to the first embodiment.

FIG. 13 is a view showing a database (table) of the data processoraccording to the first embodiment.

FIG. 14 is a functional block diagram of a data processor according to asecond embodiment of the present disclosure.

FIG. 15 is a block diagram of a substrate storage container managementsystem according to a third embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to various embodiments, examples ofwhich are illustrated in the accompanying drawings. In the followingdetailed description, numerous specific details are set forth in orderto provide a thorough understanding of the present disclosure. However,it will be apparent to one of ordinary skill in the art that the presentdisclosure may be practiced without these specific details. In otherinstances, well-known methods, procedures, systems, and components havenot been described in detail so as not to unnecessarily obscure aspectsof the various embodiments.

Hereinafter, a first embodiment of the present disclosure will bedescribed with reference to the drawings.

For example, as shown in FIG. 1, the substrate storage containermanagement system 1 according to the present embodiment is configured byan FOUP 4 which is a substrate storage container used in a semiconductormanufacturing process, a load port 2 and a host system C. Specifically,the substrate storage container management system 1 is capable oftransmitting an entity identification (ID) 4 x assigned to the FOUP 4and a sensor value on the FOUP 4 detected by a sensor 2 c provided atthe load port 2 from a communicator 2 y of the load port 2 to the hostsystem C, associating the entity identification (ID) 4 x with the sensorvalue in the host system C to create a database, and outputting a stateof the FOUP 4 based on the data of the database Cd.

As shown in FIG. 2, in the semiconductor manufacturing process, the FOUP4 is used together with an EFEM (Equipment Front End Module) including aload port 2 and a transfer chamber 3 disposed in a clean room. FIG. 2schematically shows the relative positional relationship between theEFEM and its peripheral devices.

In an internal space 3S of the transfer chamber 3, there is provided atransfer robot 31 capable of transferring a wafer W as a substratebetween the FOUP 4 and a processing apparatus M. By driving a fan filterunit 32 provided in the transfer chamber 3, a descending gas flow may begenerated in the internal space 3S of the transfer chamber 3, and a gas(environmental gas) having a high degree of cleanliness may becirculated in the internal space 3S. For example, a processing apparatusM (semiconductor processing apparatus) is provided adjacent to a rearwall 3B of the transfer chamber 3 facing a front wall 3A where the loadport 2 is disposed. In the clean room, the internal space MS of theprocessing apparatus M, the internal space 3S of the transfer chamber 3and the internal space 4S of the FOUP 4 mounted on the load port 2 aremaintained at a high degree of cleanliness. On the other hand, the spacein which the load port 2 is disposed, in other words, the outside of theprocessing apparatus M or the outside of the EFEM, is maintained at arelatively low degree of cleanliness.

In the present embodiment, as shown in FIG. 2, the load port 2, thetransfer chamber 3, and the processing apparatus M are sequentiallydisposed in close contact with each other in the front-rear direction Dof the EFEM. The operation of the EFEM is controlled by a controller ofthe load port 2 (a controller 2C shown in FIG. 4) or a controller of theentire EFEM (a controller 3C shown in FIG. 2), and the operation of theprocessing apparatus M is controlled by a controller (a controller MCshown in FIG. 2) of the processing apparatus M. In this regard, thecontroller MC, which is a controller of the entire processing apparatusM, or the controller 3C, which is a controller of the entire EFEM, is ahost controller of the controller 2C of the load port 2. The host systemC constituting the substrate storage container management system 1 isconstituted by a server and may be connected to a plurality of loadports 2 installed in a semiconductor manufacturing process. Each ofthese controllers 2C, MC and 3C is composed of an ordinarymicroprocessor which includes a CPU, a memory and an interface, etc.Programs necessary for processing are pre-stored in the memory. The CPUsequentially takes out and executes necessary programs, and cooperateswith peripheral hardware resources to realize desired functions.

As shown in FIGS. 2 and 3, the FOUP 4 includes a FOUP body 42 having aninternal space 4S that can be opened through a loading/unloading port 41as an opening, and a FOUP door 43 capable of opening and closing theloading/unloading port 41. The FOUP 4 is a known one configured toaccommodate a plurality of wafers W in multiple stages in the verticaldirection H and to allow the wafers W to be loaded or unloaded via theloading/unloading port 41.

The FOUP body 42 is provided with a shelf (wafer mounting shelf) onwhich the wafers W can be mounted at a predetermined pitch in multiplestages in the internal space 4S. On the bottom wall of the FOUP body 42,as shown in FIG. 3 and the like, ports 40 are provided at predeterminedlocations. Each of the ports 40 is mainly formed of, for example, ahollow cylindrical grommet seal fitted into a port attachmentthrough-hole formed in the bottom wall of the FOUP body 42, and isconfigured to be opened and closed by a check valve. At the center ofthe upwardly facing surface of the upper wall of the FOUP body 42, thereis provided a flange portion held by a container transfer device (forexample, an OHT: Over Head Transport).

The FOUP door 43 faces a load port door 22 of the load port 2 in a statein which the FOUP 4 is mounted on a below-described mounting table 23 ofthe load port 2, and has a substantially plate shape. The FOUP door 43is provided with a latch key (not shown) capable of locking the FOUPdoor 43 to the FOUP body 42. A gasket (not shown) is provided on apredetermined portion of the FOUP door 43 that remains in contact withor in proximity to the FOUP body 42 in a state in which theloading/unloading port 41 is closed by the FOUP door 43. By bringing thegasket into contact with the FOUP body 42 and elastically deforming thegasket, it is possible to seal the internal space 4S of the FOUP 4.

In the FOUP 4 according to the present embodiment, as shown in FIG. 1,the entity identification (ID) 4 x is attached to an appropriate place.In FIG. 1, the entity identification (ID) 4 x is schematically shown.Although an RFID (Radio Frequency Identifier) may be mentioned as anexample of the entity identification (ID) 4 x, the present disclosure isnot limited thereto. An appropriate ID may be used. The entityidentification (ID) 4 x attached to the FOUP 4 may be a passive tag, anactive tag, or a semi-active tag (actuated active tag) obtained bycombining the passive tag and the active tag. The communication methodis not particularly limited. Furthermore, as the entity identification(ID) 4 x attached to the FOUP 4, it may also be possible to use aone-dimensional barcode, or a two-dimensional barcode such as a QR code(registered trademark) or the like.

As shown in FIGS. 3 to 6 and the like, the load port 2 according to thepresent embodiment includes a plate-like base 21 constituting a part ofthe front wall 3A of the transfer chamber 3 and having an opening 21 afor opening the internal space 3S of the transfer chamber 3, a load portdoor 22 configured to open and close the opening 21 a of the base 21,and the mounting table 23 provided on the base 21 in a substantiallyhorizontal posture.

At the lower end of the base 21, there is provided a leg part 24 havinga caster and an installation leg. A window unit 214 (see FIG. 7) isprovided at a position facing the FOUP door 43. An opening 215 formed inthe window unit 214 is an opening that allows the wafer W to passtherethrough.

The mounting table 23 is provided on an upper portion of a horizontalbase 25 (support) which is disposed in a substantially horizontalposture at a position slightly above the height-direction center of thebase 21. The mounting table 23 is capable of mounting the FOUP 4 in adirection in which the FOUP door 43, which can open and close theinternal space 4S of the FOUP body 42, faces the load port door 22.Furthermore, the mounting table 23 is configured to be movable forwardand backward with respect to the base 21 between a predetermined dockingposition (see FIG. 8) at which the FOUP door 43 is close to the opening21 a of the base 21 and a position (see FIG. 3) at which the FOUP door43 is spaced apart by a predetermined distance from the base 21 ascompared with the docking position. As shown in FIG. 4, the mountingtable 23 has a plurality of protrusions (pins) 231 protruding upward. Bybringing these protrusions 231 into engagement with holes (not shown)formed on the bottom surface of the FOUP 4, it is possible to performthe positioning of the FOUP 4 on the mounting table 23. In addition,there is provided a lock claw 232 for fixing the FOUP 4 to the mountingtable 23. By establishing a lock state in which the lock claw 232 ishooked and fixed to a locked portion (not shown) provided on the bottomsurface of the FOUP 4, it is possible to fix the FOUP 4 while guidingthe FOUP 4 to a proper position on the mounting table 23 in cooperationwith the positioning protrusions 231. In addition, by releasing the lockstate of the lock claw 232 to the locked portion provided on the bottomsurface of the FOUP 4, it is possible to establish a state in which theFOUP 4 can be spaced apart from the mounting table 23.

The load port door 22 includes a connection mechanism 221 (see FIG. 6)that can be switched between a lid connection state in which theconnection mechanism 221 is connected to the FOUP door 43 to remove theFOUP door 43 from the FOUP body 42 and a lid connection release state inwhich the connection to the FOUP door 43 is released to attach the FOUPdoor 43 to the FOUP body 42. The load port door 22 is movable along apredetermined movement path while integrally holding the FOUP door 43 bythe connection mechanism 221. The load port 2 of the present embodimentis configured so that the load port door 22 can be moved at leastbetween a position shown in FIG. 8, i.e., a fully closed position (C) atwhich the internal space 4S of the FOUP body 42 is sealed by the FOUPdoor 43 held by the load port door 22, and a position shown in FIG. 9,i.e., an open position (O) at which the FOUP door 43 held by the loadport door 22 is spaced apart from the FOUP body 42 to open the internalspace 4S of the FOUP body 42 toward the inside of the transfer chamber3. The load port 2 of the present embodiment is configured so that theload port door 22 located at the fully closed position (C) can be movedto the open position (O) shown in FIG. 9 while maintaining the uprightposture of the load port door 22 and so that the load port door 22 canbe moved downward from the open position (O) to a fully opened position(not shown) while maintaining the upright posture of the load port door22. Such movement of the load port door 22 is realized by a door movingmechanism 27 provided in the load port 2. Furthermore, the load port 2of the present embodiment includes a movement restraining part L whichrestrains the FOUP 4 on the mounting table 23 located at the dockingposition from moving in the direction in which the FOUP 4 is spacedapart from the base 21. In the present embodiment, the movementrestraining part L is unitized as the window unit 214 (see FIG. 7).

The load port 2 of the present embodiment includes a purge device P thatcan inject a purge gas (mainly a nitrogen gas or a dry air) into theinternal space 4S of the FOUP 4 and can replace a gas atmosphere in theinternal space 4S of the FOUP 4 with the purge gas (see FIG. 4). Thepurge device P is provided with a plurality of purge nozzles 9 (gassupply/discharge devices) disposed at predetermined locations on themounting table 23 in a state in which the upper end portions thereof canbe exposed. These purge nozzles 9 are attached to appropriate positionson the mounting table 23 in a corresponding relationship with thepositions of the ports 40 provided on the bottom surface of the FOUP 4and can be connected to the ports 40 in contact with the ports 40. Thebottom purge process using such a purge device P is a process that fillsthe inside of the FOUP 4 with a purge gas by allowing a predeterminednumber (excluding all) of the plurality of ports 40 provided at thebottom of the FOUP 4 to function as “supply ports”, injecting anappropriate selected purge gas such as nitrogen gas, an inert gas or adry air into the FOUP 4 by the purge nozzles 9 connected to the supplyports, allowing the remaining port 40 to function as an “exhaust port”,and discharging the gas atmosphere in the FOUP 4 through the purgenozzle 9 connected to the exhaust port. The load port 2 includes apressure sensor (not shown) that detects the gas pressure (exhaustpressure) in the purge nozzle 9 connected to the port 40 functioning asthe exhaust port at the time of bottom purge processing.

As shown in FIG. 10, the load port 2 of the present embodiment includesa mapping part m capable of detecting the presence or absence of wafersW in the FOUP 4 or the storage posture of the wafers W. The mapping partm includes a mapping sensor (including a transmitter m1 and a receiverm2) capable of detecting the presence or absence of wafers W stored inmultiple stages in the height direction H inside the FOUP 4, and asensor frame m3 that supports the mapping sensor m1 and m2. The mappingpart m is capable of being switched between a mapping retraction posturein which the mapping part m as a whole is disposed in the transfer spaceinside the transfer chamber and a mapping posture in which at least themapping sensor m1 and m2 is positioned inside the FOUP 4 through theopening 21 a of the base 21. The mapping part m is configured to bemovable in the height direction H while maintaining the mappingretraction posture or the mapping posture. As shown in FIG. 10, a partof the sensor frame m3 is attached to a part of the door movingmechanism 27, whereby the vertical movement of the mapping part m isperformed together with the vertical movement of the load port door 22.In addition, the mapping part m is omitted in each of FIG. 10 andsubsequent figures.

The mapping sensor includes a transmitter m1 (light emission sensor)that emits a beam (ray) as a signal, and a receiver m2 (light receptionsensor) that receives the signal emitted from the transmitter m1.Alternatively, the mapping sensor may be configured by a transmitter anda reflector that reflects the ray emitted from the transmitter towardthe transmitter. In this case, the transmitter also serves as areceiver.

As shown in FIG. 1, the load port 2 according to the present embodimentincludes an ID reader 2 x capable of reading the entity identification(ID) 4 x attached to the FOUP 4, and the load port communicator 2 ycapable of transmitting the entity identification (ID) 4 x read by theID reader 2 x and the detected values (sensor values) of the sensors 2 c(two types of sensors including a pressure sensor and a mapping sensorin the present embodiment) that directly or indirectly detect the stateof the FOUP 4, to the host system C. The ID reader 2 x, the pressuresensor, the mapping sensor, and the load port communicator 2 y arerespectively made of general-purpose products, and are provided atpredetermined locations in the load port 2.

As shown in FIG. 1, the host system C includes a host systemcommunicator Cx, an associator Cy, a database Cd, and a data processorCz. The host system communicator Cx may receive the entityidentification (ID) 4 x and the sensor value transmitted from the loadport communicator 2 y. The associator Cy associates the sensor valuewith the entity identification (ID) 4 x received by the host systemcommunicator Cx. The database Cd stores and accumulates the dataassociated by the associator Cy, and the data processor Cz analyzes thedata in the database Cd and outputs the state for each entityidentification (ID) 4 x (the prediction result of the replacement timeof the FOUP 4 in the present embodiment). The host system communicatorCx, the associator Cy, and the database Cd may be configured usinggeneral-purpose products. Specific processing contents in the dataprocessor Cz will be described later.

Next, the operation flow of the substrate storage container managementsystem 1 according to the present embodiment will be described alongwith the operation flow of the EFEM.

First, the FOUP 4 is transported to the upper side of the load port 2 bya container transfer device such as an OHT or the like and mounted onthe mounting table 23. At this time, for example, the positioningprotrusions 231 provided on the mounting table 23 are fitted into thepositioning recesses of the FOUP 4, and the lock claw 232 on themounting table 23 is brought into a locked state (locking process). Inthe present embodiment, the FOUP 4 may be mounted on each of themounting tables 23 of three load ports 2 arranged side by side in thewidth direction of the transfer chamber 3. Furthermore, the mounting ofthe FOUP 4 at a regular position on the mounting table 23 is detected bya seating sensor (not shown) for detecting whether or not the FOUP 4 ismounted at a predetermined position on the mounting table 23.

In the load port 2 of the present embodiment, when the FOUP 4 is mountedat the normal position on the mounting table 23, it may be detected thatthe bottom surface portion of the FOUP 4 presses, for example, a pressedportion of a pressure sensor provided on the mounting table 23. Inresponse to this, the purge nozzles 9 (all the purge nozzles 9) providedon the mounting table 23 are moved upward beyond the upper surface ofthe mounting table 23 and are connected to the ports 40 of the FOUP 4,whereby the ports 40 are switched from the closed state to the openstate. Then, the load port 2 of the present embodiment performs aprocess (bottom purge process) in which a nitrogen gas is supplied tothe internal space 4S of the FOUP 4 by the purge device P to replace theinternal space 4S of the FOUP 4 with the nitrogen gas. During the bottompurge process, the gas atmosphere in the FOUP 4 is exhausted to theoutside of the FOUP 4 from the purge nozzle 9 connected to the port 40functioning as an exhaust port. By virtue of such a bottom purgeprocess, the moisture concentration and the oxygen concentration in theFOUP 4 are reduced to predetermined values or less, respectively,whereby the ambient environment of the wafers W in the FOUP 4 isconverted to a low humidity environment and a low oxygen environment.

After the locking process, the load port 2 of the present embodimentperforms a process of moving the mounting table 23 existing at theposition shown in FIG. 2 to the docking position shown in FIG. 8(docking process), a process of holding and fixing at least both sidesof the FOUP 4 through the use of the movement restraining part L(clamping process), a process of switching the connection mechanism 221to the lid connection state (lid connecting process), and a process ofreleasing the sealed state of the FOUP 4 by moving the FOUP door 43together with the load port door 22 to open the opening 21 a of the base21 and the loading/unloading port 41 of the FOUP 4 (sealing releasingprocess). The load port 2 of the present embodiment performs a mappingprocess through the use of the mapping part m during the process ofmoving the load port door 22 from the open position (O) to the fullyopened position. The mapping process is a process in which the mappingpart m having kept in the mapping retraction posture until immediatelybefore performing the sealing releasing process is switched to themapping posture after the load port door 22 is moved from the fullyclosed position (C) to the open position (O), the load port door 22 ismoved downward toward the fully opened position, the mapping part m isalso moved downward while maintaining the mapping posture, and thepresence or absence and the storage posture of the wafers W stored inthe FOUP 4 are detected using the mapping sensor m1 and m2. That is tosay, the signal path formed between the transmitter m1 and the receiverm2 by transmitting a signal from the transmitter m1 to the receiver m2is interrupted at a location where the wafer W exists, and is notinterrupted at a location where the wafer W does not exist, so that thesignal reaches the receiver m2. Thus, the presence or absence and thestorage posture of the wafers W stored side by side in the heightdirection H inside the FOUP 4 can be sequentially detected.

By performing the sealing releasing process, the internal space 4S ofthe FOUP body 42 and the internal space 3S of the transfer chamber 3 arein communication with each other. Based on the information (waferposition) detected in the mapping process, the transfer robot 31provided in the internal space 3S of the transfer chamber 3 performs aprocess of taking out the wafer W from a specific wafer placement shelf,or storing the wafer W in a specific wafer placement shelf (transferprocess).

When all the wafers W in the FOUP 4 have been processed by theprocessing apparatus M, the load port 2 according to the presentembodiment performs a process of sealing the internal space 4S of theFOUP 4 by moving the load port door 22 to the fully closed position (C)through the use of the door moving mechanism 27 to close the opening 21a of the base 21 and the loading/unloading port 41 of the FOUP 4(sealing process), and then performs a process of switching theconnection mechanism 221 from the lid connection state to the lidconnection release state (lid connection releasing process). By virtueof this process, the FOUP door 43 can be attached to the FOUP body 42.The opening 21 a of the base 21 and the loading/unloading port 41 of theFOUP 4 are closed by the load port door 22 and the FOUP door 43,respectively. Thus, the internal space 4S of the FOUP 4 comes into asealed state.

Subsequently, the load port 2 according to the present embodimentperforms a clamp releasing process of releasing the fixed state (clampedstate) of the FOUP 4 caused by the movement restraining part L, and thenperforms a process of moving the mounting table 23 in a direction awayfrom the base 21 (undocking process). Thereafter, the load port 2releases the state in which the FOUP 4 is locked by the lock claw 232 onthe mounting table 23 (unlocking process). As a result, the FOUP 4 thatstores the wafers W for which predetermined processing has beencompleted is delivered from the top of the mounting table 23 of eachload port 2 to the container transfer device and is carried out to thenext process.

In the course of performing the above process, the substrate storagecontainer management system 1 according to the present embodimentoutputs the state of the FOUP 4 mounted on the mounting table 23 of theload port 2 (specifically, the management system 1 predicts thereplacement time of the FOUP 4). That is to say, the substrate storagecontainer management system 1 according to the present embodiment readsthe entity identification (ID) 4 x of the FOUP 4 by the ID reader 2 x ofthe load port 2 when the FOUP 4 is set on the mounting table 23 of theload port 2. The entity identification (ID) 4 x thus read is transmittedto the associator Cy of the host system C by the load port communicator2 y. Then, when performing the process of purging the inside of the FOUP4 (bottom purge process), the substrate storage container managementsystem 1 according to the present embodiment detects the pressure of theexhaust gas using the pressure sensor provided in association with theexhaust purge nozzle 9 of the load port 2, and transmits the detectedvalue (pressure value) to the associator Cy of the host system C.

The host system C receives the entity identification (ID) 4 x and thepressure value using the host system communicator Cx, associates theentity identification (ID) 4 x with the pressure value using theassociator Cy, and preserves (stores and accumulates) the associateddata in the database Cd. Furthermore, at the time of the mapping processperformed by the mapping part m, the substrate storage containermanagement system 1 according to the present embodiment transmits thewafer position, which is the detected value of the mapping sensor, tothe associator Cy of the host system C using the load port communicator2 y. The host system C receives the wafer position using the host systemcommunicator Cx, associates the entity identification (ID) 4 x with thewafer position using the associator Cy, and preserves (stores andaccumulates) the associated data in the database Cd.

As a result, in the host system C, the detected values of the varioussensors provided in the load port 2 (the pressure value of the pressuresensor and the wafer position of the mapping sensor in the presentembodiment) are associated with the entity identification (ID) 4 xassigned to the FOUP 4 to create a database. In the present embodiment,as in the table of FIG. 13, the measurement date and time are storedtogether with the entity identification (ID) 4 x for each FOUP 4, thepressure value of the pressure sensor (exhaust nozzle pressure value ofFIG. 13), and the wafer position of the mapping sensor (FOUP waferposition of FIG. 13). Then, the data processor Cz of the host system Canalyzes the collected data and predicts the replacement time of theFOUP 4. In addition, the expansion of a gap between theloading/unloading port 41 of the FOUP 4 and the FOUP door 43 may bedetermined based on the change in the pressure value of the exhaust gasdetected by the pressure sensor provided in association with the exhaustpurge nozzle 9 of the load port 2. That is to say, if it is found thatthe pressure of the gas exhausted from the exhaust purge nozzle 9 islow, it is understood that the exhaust amount through the gap betweenthe loading/unloading port 41 of the FOUP 4 and the FOUP door 43 islarge. It can be determined that the gap between the loading/unloadingport 41 of the FOUP 4 and the FOUP door 43 is wide, which makes itpossible to specify the deformation of the FOUP 4. Furthermore, asdescribed above, when the detected value of the mapping sensor isdifferent from the previous detected value (when the positionaldisplacement of the wafer W is generated), it can be considered that theFOUP 4 is deformed and the position of the wafer W is changed. That isto say, the gap between the wafers W stored in multiple stages insidethe FOUP 4 is changed as the deformation of the FOUP 4 progresses.Therefore, the deformation of the FOUP 4 can be specified by detectingsuch a change, or the deformation of the FOUP 4 can be specified bydetecting that the wafers W are stored in an inclined posture.

As shown in FIG. 11A, the data processor Cz in the present embodimentincludes a calculator Cz1 for calculating statistical data from thesensor values (the pressure value and the wafer position) detected byspecific sensors 2 c (the pressure sensor and the mapping sensor in thepresent embodiment), a comparator Cz2 for comparing the sensor valueassociated with a specific entity identification (ID) 4 x and thecalculation result obtained by the calculator Cz1, and a predictionresult output means Cz3 for calculating the replacement time of the FOUP4 based on the comparison result obtained by the comparator Cz2 andoutputting a prediction result. That is to say, the data processor Cz inthe present embodiment predicts the replacement time of the FOUP 4 basedon the numerical values obtained by averaging the data stored andaccumulated in the database Cd for each of the various sensors. In thisregard, the “prediction result output means Cz3” corresponds to the“state output means for outputting the state of the substrate storagecontainer based on the result obtained by the comparator” in the presentdisclosure. The “prediction result output means Cz3” is an example ofthe “state output means”.

Specifically, as shown in the flowchart of FIG. 11B, the calculator Cz1of the data processor Cz performs a process of acquiring data for eachentity identification (ID) 4 x of the FOUP 4 from the database Cd andgraphing various sensor values for each entity identification (ID) 4 x,and a process of averaging the graphed sensor values (sensor valuegraphs) of each entity identification (ID) 4 x for each type of sensor,i.e., a process of creating a sensor value average graph for each typeof sensor 2 c (a process of calculating statistical data). FIG. 12Ashows an example of a “sensor value graph” regarding “a sensor value ofa first sensor” (for example, the pressure value of the pressure sensor)associated with the entity identification (ID) “A”. FIG. 12B shows anexample of a “sensor value graph” regarding “a sensor value of a secondsensor” (for example, the wafer position of the mapping sensor)associated with the entity identification (ID) “A”. Furthermore, FIG.12C shows an example of “a sensor value graph” regarding “a sensor valueof a first sensor” associated with the entity identification (ID) “A”,“a sensor value graph” regarding a sensor value of a first sensorassociated with the entity identification (ID) “B”, and “a sensor valueaverage graph regarding a first sensor” created based on these “sensorvalue graphs”.

Subsequent to the process of creating the sensor value average graph,the comparator Cz2 of the data processor Cz analyzes (compares andreviews) the sensor value average graph and the sensor value graphcreated for each entity identification (ID) 4 x. The analysis in thiscase may include, for example, a process of calculating and determininga degree of deviation of the sensor value to be compared with the sensorvalue average graph, or a degree of approach of the sensor value to aset threshold value (or whether the sensor value exceeds a thresholdvalue). FIG. 12D shows, side by side, the sensor value average graph ofthe first sensor and the sensor value graph regarding the sensor valueof the first sensor associated with the entity identification (ID)

Then, the prediction result output means Cz3 of the data processor Czanalyzes (compares and reviews) the replacement time prediction resultbased on the detected values of various sensors for the same entityidentification (ID) 4 x, predicts the replacement time for each entityidentification (ID) 4 x (for each FOUP 4), and outputs a predictionresult. In this case, it is possible to perform a process of setting apriority (weighting value) for each type of sensor, or calculating anaverage value. That is to say, when the predicted replacement time isdifferent for each type of sensor (for example, when the replacementtime based on the detected value of the first sensor is April 23 and thereplacement time based on the detected value of the second sensor isApril 25), the earliest predicted replacement time (April 23) may beoutputted as the predicted replacement time of the FOUP, or the averageor mean value (April 24) of the predicted replacement times of therespective sensors may be outputted as the predicted replacement time ofthe FOUP, or the latest predicted replacement time (April 25) may beoutputted as the predicted replacement time of the FOUP. In addition,instead of setting the aforementioned weight value or calculating theaverage value, a threshold value of the sensor value, the number oftimes of use of the FOUP 4, or the like may be arbitrarily set and thereplacement time of the FOUP 4 may be outputted when it falls outsidethe set threshold or the number of times of use of the FOUP 4.

The replacement time prediction result for each entity identification(ID) 4 x (for each FOUP 4) outputted by the data processor Cz may bedisplayed on, for example, a display that can be visually recognized bythe user, or may be emitted and notified as a sound from an appropriatespeaker or the like. This enables the user to grasp the replacement timeprediction result for the FOUP 4.

According to the substrate storage container management system 1 and thesubstrate storage container management method of the present embodiment,the entity identification (ID) 4 x assigned to the FOUP 4 already usedin many manufacturing sites and the detected value obtained by thesensor 2 c provided in the load port 2 are associated in the host systemC to create a database, the data in the database Cd is analyzed by thedata processor Cz of the host system C, and the state of the FOUP 4 foreach entity identification (ID) 4 x (specifically, the prediction resultof the replacement time) is outputted, whereby deterioration informationof the FOUP 4 can be acquired. By utilizing the substrate storagecontainer management system 1 according to the present disclosure, theuser can grasp the replacement time of each FOUP 4 predicted based onthe detected value of the sensor 2 c provided in the load port 2. Then,by replacing the FOUP 4 close to the replacement time or the FOUP 4having reached the replacement time with a new FOUP 4, it is possible toprevent or suppress a problem caused by the deformation or distortion ofthe FOUP 4, i.e., a problem that a gap between the loading/unloadingport 41 and the FOUP door 43 of the FOUP 4 grows larger and a gas flowsinto or leaks from the FOUP 4 through the gap. After the purge processof replacing the gas in the FOUP 4 with a nitrogen gas, it is possibleto maintain the inside of the FOUP 4 at a low oxygen concentration for apredetermined period of time by preventing a situation that the nitrogengas flows from the inside of the FOUP 4 to the outside of the FOUP 4 orthe atmosphere (oxygen) flows into the FOUP 4. It is possible to preventor suppress a situation that the surfaces of the wafers accommodated inthe FOUP 4 are oxidized. As a result, it is possible to reduce thefrequency of occurrence of errors due to the deformation of the FOUP 4.Thus, the down time of the semiconductor manufacturing apparatus isshortened, and the productivity is improved.

In particular, considering that the task of providing instruments suchas a sensor and the like in all the FOUPs 4 is onerous and complex, thesubstrate storage container management system 1 and the substratestorage container management method according to the present embodimentare advantageous in that it is only necessary to assign an entityidentification (ID) 4 x to the currently available FOUP 4 and in that itis not necessary to mount a sensor power supply on each FOUP 4 ascompared with an embodiment in which a sensor is provided for each FOUP4 as described as the prior art. There is no need to newly prepare adedicated substrate storage container applicable to the substratestorage container management system 1 and the substrate storagecontainer management method. Thus, the substrate storage containermanagement system 1 and the substrate storage container managementmethod can be easily introduced into the manufacturing sites(manufacturing lines).

In addition, the substrate storage container management system 1 and thesubstrate storage container management method according to the presentembodiment are advantageous in that, by setting the installation targetof the sensor to the load port 2, as compared with an embodiment inwhich a sensor is provided for each FOUP 4 as described as the priorart, it is possible to reduce the absolute number of sensors subjectedto maintenance and to alleviate the burden of maintenance and it is notnecessary to pay attention to the failure of instruments such as asensor and the like caused by the heat or water intrusion at the time ofcleaning the FOUP 4 with hot water. Furthermore, the power supply to theID reader 2 x, the sensor 2 c and the load port communicator 2 y of theload port 2 can be relatively easily performed using the electricalsystem of the load port 2.

Moreover, according to the substrate storage container management system1 and the substrate storage container management method of the presentembodiment, it is possible to predict the demand of the substratestorage container. That is to say, from the result of prediction of thereplacement time of the FOUP 4 as a substrate storage container, thenumber of FOUPs 4 predicted to be replaced (discarded) at thereplacement time can be predicted as the number of new FOUPs 4 to beintroduced. Furthermore, according to the substrate storage containermanagement system 1 and the substrate storage container managementmethod of the present embodiment, it is considered that the datacollected in the database Cd can be used as big data, and the cause ofdeterioration of the substrate storage container can be pursued by datamining.

In addition, as in the second embodiment described below, machinelearning may be used to analyze the data stored in the database Cd.

In the first embodiment, the data processor Cz of the host system C isconfigured as shown in FIG. 11A. However, in the second embodiment, thedata processor Ce shown in FIG. 14 is used. The configurations otherthan the data processor Ce are the same as those of the first embodimentand, therefore, the detailed description thereof is omitted.

In the present embodiment, as in the first embodiment (FIG. 1), in thecourse of opening or closing the FOUP door 43 with respect to the FOUP 4by the load port 2, the state of the FOUP 4 is directly or indirectlydetected using a single sensor 2 c or a plurality of sensors 2 c.Furthermore, the sensor value detected by the sensor 2 c is preserved(stored or accumulated) in the database Cd of the host system C. Thedata preserved in the database Cd is stored as a record in which, as inthe table shown in FIG. 13, the entity identification (ID) 4 x and thesensor value detected by the sensor 2 c are associated by the associatorCy and the measurement date and time is given. The data preserved in thedatabase Cd is processed and analyzed by the data processor Ce shown inFIG. 14 and is used for prediction and maintenance of the state of theFOUP 4, the replacement time prediction or the like.

The specific configuration of the data processor Ce will be describedbelow. The data processor Ce includes a learning means Ce1 and aprediction result output means Ce2 as shown in the block diagram of FIG.14. The learning means Ce1 is composed of, for example, a neuralnetwork.

Hereinafter, a procedure for constructing a learned model by thelearning means Ce1 of the data processor Ce of the present embodimentwill be described. First, the time series data of the sensor value ofthe sensor 2 c for each FOUP 4 and the date on which the FOUP 4 isactually deteriorated or deformed and becomes unusable are extractedfrom the database Cd and are inputted to the neural network of thelearning means Ce1. Then, in the neural network, various parameters areupdated according to the inputted data, and learning proceeds. A learnedmodel is constructed by repeating this process.

If the data for each FOUP 4 preserved in the database Cd is inputted tothe learned model constructed according to the above procedure, it ispossible to estimate the state of the FOUP 4 and to output theprediction result of the replacement time. Therefore, the state of theFOUP 4 and the replacement time prediction outputted from the learnedmodel are outputted using the prediction result output means Ce2.

In the present embodiment, the learned model is constructed using theneural network. However, it is also possible to use other methods.Although the supervised learning is used in the present embodiment,unsupervised learning may be used. It may also be possible to use analgorithm that updates the learned model as needed. Furthermore, in thepresent embodiment, the date and time at which the FOUP 4 becomesunusable is extracted from the database Cd to construct the learnedmodel. However, a learned model may be constructed using the dataavailable when the FOUP 4 can be normally used, and prediction andmaintenance may be performed.

Furthermore, as in the third embodiment described below, the operationof the load port 2 may be adjusted for each FOUP 4 using the state ofthe FOUP 4 for each entity identification (ID) 4 x outputted by the dataprocessor Cz and other data preserved in the database Cd.

The host system C of the first embodiment is configured as shown inFIG. 1. However, in the third embodiment, the host system C shown inFIG. 15 is used. The configuration of the load port 2 is the same asthat of the first embodiment and, hence, the detailed descriptionthereof is omitted.

As shown in FIG. 15, the host system C of the present embodimentincludes a host system communicator Cx, an associator Cy, a database Cd,a data processor Cz, and an operation adjuster Ca. The host systemcommunicator Cx may bilaterally transmit and receive data signals to andfrom the load port communicator 2 y and may receive the entityidentification (ID) 4 x read by the ID reader 2 x of the load port 2 andthe sensor value detected by the sensor 2 c. The sensor value to bereceived may be one type or plural types. The associator Cy associatesthe entity identification (ID) 4 x and the sensor value with each other.The database Cd stores and accumulates the data associated by theassociator Cy. Just like the first embodiment (see FIG. 13), in thedatabase Cd, the data given measurement date and time is accumulated inthe data in which the entity identification (ID) 4 x and the sensorvalue are associated with each other. The data processor Cz analyzes thedata in the database Cd and outputs the state of each entityidentification (ID) 4 x. In the present embodiment, the state of theFOUP 4 outputted by the data processor Cz is also associated with theentity identification (ID) 4 x and is stored in the database Cd.

The processing procedure of the FOUP 4 performed by the load port 2 andthe host system C of the present embodiment will be described. First,when the FOUP 4 is mounted on the mounting table 23 of the load port 2,the entity identification (ID) 4 x of the FOUP 4 is read by the IDreader 2 x of the load port 2. Next, the load port communicator 2 ytransmits the entity identification (ID) 4 x of the FOUP 4 to the hostsystem communicator Cx. In the host system C, the received state data ofthe FOUP 4 for the entity identification (ID) 4 x is inquired to thedatabase Cd, and the state data obtained as a result thereof is inputtedto the operation adjuster Ca. The operation adjuster Ca adjusts theoperation at the time of processing the FOUP 4 with the load port 2 inaccordance with the state of the FOUP 4.

For example, in the case of the FOUP 4 whose deformation has notoccurred yet, an instruction is transmitted to the load port 2 via thehost system communicator Cx so as to perform processing as usual. In thecase of the FOUP 4 in which deformation or deterioration has occurred,there is a high possibility that an error will be generated during theprocessing performed at the load port 2. Therefore, an instruction istransmitted to the load port 2 via the host system communicator Cx so asto, for example, set a higher number of retries when an error isgenerated. By setting the number of retries (corresponding to the“control value related to the processing of the substrate storagecontainer” of the present disclosure) according to the state of the FOUP4 as described above, even if the FOUP 4 has been deformed ordeteriorated, it is possible to allow processing to proceed smoothlywithout frequently generating an error at the load port 2.

Furthermore, the data used when the operation adjuster Ca adjusts thecontrol value may refer not only to the state of the FOUP 4 but also toother data. For example, the information on the error generated duringthe processing of the FOUP 4 at the load port 2 may be associated withan entity identification (ID) and preserved in the database Cd, and theoperation adjuster Ca may adjust the operation of the load port 2 basedon the information on the error preserved in the database Cd.Specifically, the operation adjuster Ca may calculate an error easilygenerated for each FOUP 4 and may adjust the operation of the load port2 for each FOUP 4. As an example, in the case of the FOUP 4 in which anerror is easily generated during the docking process between the loadport door 22 and the FOUP 4, the operation of the load port 2 may beadjusted so that the pressure during the docking process between theload port 2 and the FOUP 4 (corresponding to the “control value on theprocessing of the substrate storage container” of the presentdisclosure) becomes a pressure higher than that of an ordinary dockingprocess. By grasping the easily generated error and adjusting theoperation of the load port 2 for each FOUP 4 in advance as describedabove, it is possible to prevent the generation of an error. Inaddition, various methods such as a statistical method, data mining,machine learning and the like may be used for the calculation of anerror easily generated for each FOUP 4. Moreover, the calculation of anerror easily generated for each FOUP 4 may be performed by a part otherthan the operation adjuster Ca. For example, the operation adjuster Camay adjust the operation of the load port 2 by calculating an erroreasily generated for each FOUP 4 in the data processor Cd and inputtingthe calculation result to the operation adjuster Ca.

In addition, the information related to the processing performed on thewafer W stored in the FOUP 4 may be associated with the entityidentification (ID) and preserved in the database Cd, and the operationadjuster Ca may adjust the operation of the load port 2 for each FOUP 4based on the information related to the processing performed on thewafer W. For example, when the FOUP 4 storing the wafer W subjected to aheat treatment is processed at the load port 2 of the next process, theatmosphere in the FOUP 4 is cooled and the pressure in the FOUP 4 ischanged during the transfer of the FOUP 4 to the load port 2 of the nextprocess. In this case, the FOUP door 43 may not be easily opened andclosed. Therefore, the number of retries (corresponding to the “controlvalue related to the processing of the substrate storage container” ofthe present disclosure) may be made larger than an ordinary one. Asdescribed above, by adjusting the operation of the load port 2 withreference to the information on the processing of the wafer W performedin the previous process using the entity identification (ID) 4 x whenthe FOUP 4 is mounted on the load port 2, it is possible to smoothlyperform the processing without frequently generating an error at theload port 2.

In the present embodiment, the operation adjuster Ca adjusts theoperation of the load port 2 using one of the state of the FOUP 4, theinformation on the error generated during the processing of the FOUP 4,and the information related to the processing performed on the wafer Wstored in the FOUP 4. However, the operation of the load port 2 may beadjusted based on other kinds of information, or may be adjusted bycombining plural kinds of information.

Although the embodiments of the present disclosure have been describedabove, the present disclosure is not limited to the configurations ofthe embodiments described above. For example, in the above-describedembodiments, the associator Cy, the database Cd, the data processor Czand the operation adjuster Ca are provided in the host system Cdifferent from the load port 2. However, it is not essential that thesefunctional parts be provided in the host system C. For example, theassociator Cy may be provided in the load port 2, and the entityidentification (ID) 4 x and the sensor value associated in advance inthe load port 2 may be transmitted from the load port 2 to the hostsystem C. The database Cd, the data processor Cz and the operationadjuster Ca may be similarly provided at the load port 2.

Moreover, in the above-described embodiments, there has been illustratedan example where the sensor values transmitted from the load port to thehost system are sensor values of two types of sensors. However, thesensor value transmitted from the load port to the host system may be asensor value of one type of sensor, or may be sensor values of three ormore types of sensors. Furthermore, the installation location of thehost system may be inside or outside a factory where semiconductormanufacturing is performed, and the data of a plurality of semiconductormanufacturing factories or a plurality of semiconductor manufacturingprocesses may be collectively managed or processed by a single hostsystem. Moreover, it is also possible to distribute the functions of thehost system to a plurality of computers or servers. The format of thedata preserved in the database is not limited to the table described inthe embodiments. The data may also be preserved in a format other thanthe table described in the embodiments. In addition, in theabove-described embodiments, the time series of data is shown byattaching the measurement date and time to the data preserved in thedatabase. However, the data may be replaced by another data from whichthe time series can be grasped.

Examples of the “sensor for directly or indirectly detecting the stateof the FOUP” in the present disclosure are not limited to theabove-described “exhaust nozzle pressure sensor” and the “mappingsensor”, but may include a “sensor capable of directly or indirectlydetecting the time taken for the container door (FOUP door) to move fromthe fully closed position to the open position” and a “torque sensor formeasuring the rotational torque of a latch key of the container door(FOUP door).” By acquiring “the movement time of the container door(FOUP door) from the fully closed position to the open position” asdata, it is possible to grasp whether or not the container door (FOUPdoor) is difficult to open. From the sensor value (data) in which themovement time of the container door (FOUP door) from the fully closedposition to the open position is long, it is possible to determine anevent that the container door (FOUP door) is difficult to open, i.e., apossibility that the substrate storage container is deformed. Inaddition, it may be possible to attach a sensor capable of measuring thetorque or pressure necessary for docking the container door (FOUP door)and the load port door during the docking process of the FOUP.

In addition, by acquiring the “rotational torque value of a latch key ofthe container door (FOUP door)” as data, it is possible to grasp whetheror not the latch key is difficult to rotate. From the data in which therotational torque value is large, it is possible to determine an eventthat the latch key is difficult to rotate, i.e., a possibility that thesubstrate storage container is deformed.

Furthermore, as for the connection mechanism provided at the load portdoor to connect the container door (FOUP door) to the load port door, asensor capable of detecting an appropriate connection state establishedby the connection mechanism may be provided at the load port, and theconnection failure caused by the deformation of the substrate storagecontainer may be estimated and determined according to a change in thedetected value of the sensor. In addition, by acquiring a sensor valuefrom a gauge for measuring an oxygen concentration in the exhaust gasexhausted from the exhaust nozzle, it is possible to estimate anddetermine how much the inflow of an ambient air due to the deformationof the substrate storage container affects the wafers contained in thesubstrate storage container. In addition, by detecting a lock error ofthe lock claw provided at the mounting table of the load port, it ispossible to estimate the scraping of the locked portion (the portionengaging with the lock claw) provided on the bottom surface of thesubstrate storage container. In addition, the number of lock errors ofthe lock claw may be measured.

Furthermore, the data processor of the host system may be able to outputthe state of the substrate storage container (for example, predict thereplacement time of the substrate storage container) by using a datamining method.

When the detection (measurement) of a tact time indicates that time istaken with respect to the standard tact time, if there is a tendencythat time is taken just as much as a specific load port takes time, itis possible to determine that there is a time loss due to the load port.Thus, a message prompting the adjustment of the load port is notified.If there is a tendency that time is taken even though a particularsubstrate storage container is placed on any load port, it is possibleto determine that a time loss has occurred due to the substrate storagecontainer. Thus, a message for checking the substrate storage containeror a message prompting the replacement thereof may be notified. Inaddition, when a process of setting the gas supply amount to a largervalue and increasing the internal pressure of the substrate storagecontainer during the bottom purge process so that the container door(FOUP door) can be easily opened is performed by the operation adjusterwith respect to the substrate storage container whose container door(FOUP door) cannot bet easily opened, the atmosphere in the substratestorage container is likely to leak to the outside. When a process inwhich the oxygen concentration around the load port may decrease isperformed as described above, the fact may be notified to a worker.

In the above-described embodiments, the FOUP used for wafer transfer isadopted as the substrate storage container. However, in the presentdisclosure, it is also possible to use a substrate storage containerother than the FOUP, for example, a MAC (Multi Application Carrier), anH-MAC (Horizontal-MAC), a FOSB (Front Open Shipping Box), or the like.

In the above-described embodiments, the nitrogen gas is illustrated asthe environmental gas used for a bottom purge process or the like.However, the present disclosure is not limited thereto. It may bepossible to use a desired gas (inert gas) such as a dry gas, an argongas or the like.

Furthermore, the container door (FOUP door) may be temporarily kept inan inclined posture (with an operation of drawing a partial arc-likelocus) in the process of moving from the fully closed position to thefully opened position.

In addition, the specific configurations of the respective parts are notlimited to those of the above-described embodiments, and variousmodifications may be made without departing from the scope of thepresent disclosure.

According to the present disclosure in some embodiments, a substratestorage container management system capable of assigning an entityidentification (ID) to a substrate storage container such as an FOUP orthe like, associating a sensor value of a sensor provided at a load portwith the entity identification (ID) using IoT (Internet of Things) tocreate a database, determining a deterioration state of the substratestorage container attributable to the use thereof based on the data ofthe database, and predicting a replacement timing of a substrate storagecontainer can be realized by applying a generally used FOUP instead of adedicated FOUP provided with instruments such as a sensor and the like.According to the present disclosure, it is possible to acquireinformation on deformation of the substrate storage container withoutrequiring time to measure the shape of the substrate storage container.By specifying the substrate storage container to be replaced andreplacing the specified substrate storage container with a new substratestorage container, it is possible to suppress oxidation of the surfacesof wafers stored in the substrate storage container.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosures. Indeed, the embodiments described herein maybe embodied in a variety of other forms. Furthermore, various omissions,substitutions and changes in the form of the embodiments describedherein may be made without departing from the spirit of the disclosures.The accompanying claims and their equivalents are intended to cover suchforms or modifications as would fall within the scope and spirit of thedisclosures.

What is claimed is:
 1. A substrate storage container management systemcomprising: a load port that is configured to transfer a substrate intoand out of one or more substrate storage containers, and includes: an ID(identification) reader configured to read one or more entity IDs forthe one or more substrate storage containers; and one or more sensorsconfigured to directly or indirectly detect one or more states of theone or more substrate storage containers; an associator configured toassociate the one or more entity IDs read by the ID reader with one ormore sensor values detected by the one or more sensors; a database inwhich data associated by the associator is accumulated; and a dataprocessor configured to analyze the data in the database and to output astate of a respective substrate storage container for each of the one ormore entity IDs.
 2. The substrate storage container management system ofclaim 1, wherein the data processor includes: a calculator configured tocalculate statistical data from one or more sensor values detected by aspecific sensor of the one or more sensors; a comparator configured tocompare a sensor value associated with a specific entity ID of the oneor more entity IDs for a specific substrate storage container with acalculation result obtained by the calculator; and a state output partconfigured to output a state of the specific substrate storage containerbased on a comparison result obtained by the comparator.
 3. Thesubstrate storage container management system of claim 1, wherein theone or more sensors of the load port include plural types of sensors,and wherein the associator is configured to associate the one or moreentity IDs with plural types of sensor values detected by the pluraltypes of sensors.
 4. The substrate storage container management systemof claim 2, wherein the one or more sensors of the load port includeplural types of sensors, and wherein the associator is configured toassociate the one or more entity IDs with plural types of sensor valuesdetected by the plural types of sensors.
 5. The substrate storagecontainer management system of claim 1, further comprising an operationadjuster configured to adjust a control value associated with processingof the respective substrate storage container at the load port based onthe state of the respective substrate storage container for each of theone or more entity IDs that is outputted by the data processor.
 6. Thesubstrate storage container management system of claim 2, furthercomprising an operation adjuster configured to adjust a control valueassociated with processing of the respective substrate storage containerat the load port based on the state of the respective substrate storagecontainer for each of the one or more entity IDs that is outputted bythe data processor.
 7. The substrate storage container management systemof claim 3, further comprising an operation adjuster configured toadjust a control value associated with processing of the respectivesubstrate storage container at the load port based on the state of therespective substrate storage container for each of the one or moreentity IDs that is outputted by the data processor.
 8. The substratestorage container management system of claim 1, wherein the associatoris configured to associate the one or more entity IDs with at least oneof error information that is generated during processing of therespective substrate storage container and process information onprocessing of the substrate stored in the respective substrate storagecontainer, and wherein the substrate storage container management systemfurther comprises an operation adjuster configured to adjust a controlvalue associated with the processing of the respective substrate storagecontainer at the load port based on the at least one of the errorinformation and the process information for each of the one or moreentity IDs that is accumulated in the database.
 9. The substrate storagecontainer management system of claim 2, wherein the associator isconfigured to associate the one or more entity IDs with at least one oferror information that is generated during processing of the respectivesubstrate storage container and process information on processing of thesubstrate stored in the respective substrate storage container, andwherein the substrate storage container management system furthercomprises an operation adjuster configured to adjust a control valueassociated with the processing of the respective substrate storagecontainer at the load port based on the at least one of the errorinformation and the process information for each of the one or moreentity IDs that is accumulated in the database.
 10. The substratestorage container management system of claim 3, wherein the associatoris configured to associate the one or more entity IDs with at least oneof error information that is generated during processing of therespective substrate storage container and process information onprocessing of the substrate stored in the respective substrate storagecontainer, and wherein the substrate storage container management systemfurther comprises an operation adjuster configured to adjust a controlvalue associated with the processing of the respective substrate storagecontainer at the load port based on the at least one of the errorinformation and the process information for each of the one or moreentity IDs that is accumulated in the database.
 11. The substratestorage container management system of claim 1, further comprising ahost system configured to communicate with the load port, wherein atleast the associator, the database, and the data processor are providedin the host system.
 12. The substrate storage container managementsystem of claim 2, further comprising a host system configured tocommunicate with the load port, wherein at least the associator, thedatabase, and the data processor are provided in the host system. 13.The substrate storage container management system of claim 3, furthercomprising a host system configured to communicate with the load port,wherein at least the associator, the database, and the data processorare provided in the host system.
 14. The substrate storage containermanagement system of claim 1, wherein the data processor includes alearning part configured to learn the one or more states of the one ormore substrate storage containers from the one or more sensor valuesdetected by the one or more sensors.
 15. The substrate storage containermanagement system of claim 2, wherein the data processor includes alearning part configured to learn the one or more states of the one ormore substrate storage containers from the one or more sensor valuesdetected by the one or more sensors.
 16. The substrate storage containermanagement system of claim 3, wherein the data processor includes alearning part configured to learn the one or more states of the one ormore substrate storage containers from the one or more sensor valuesdetected by the one or more sensors.
 17. A load port for transferring asubstrate into and out of one or more substrate storage containers,comprising: an ID reader configured to read one or more entity IDs forthe one or more substrate storage containers; and one or more sensorsconfigured to directly or indirectly detect one or more states of theone or more substrate storage containers, wherein the load port isemployed in a substrate storage container management system comprising:an associator configured to associate the one or more entity IDs read bythe ID reader with one or more sensor values detected by the one or moresensors; a database in which data associated by the associator isaccumulated; and a data processor configured to analyze the data in thedatabase and to output a state of a respective substrate storagecontainer for each of the one or more entity IDs.
 18. A substratestorage container management method, comprising: reading, by a load portconfigured to transfer a substrate into and out of one or more substratestorage containers, one or more entity IDs for the one or more substratestorage containers; detecting, by one or more sensors provided at theload port, one or more states of the one or more substrate storagecontainers, directly or indirectly; associating the one or more entityIDs with one or more sensor values that are detected in the act ofdetecting the one or more states; accumulating data associated in theact of associating the one or more entity IDs in a database; andanalyzing the data in the database and outputting a state of arespective substrate storage container for each of the one or moreentity IDs.
 19. The method of claim 18, further comprising adjusting acontrol value associated with processing of the respective substratestorage container at the load port based on the state of the respectivesubstrate storage container for each of the one or more entity IDs thatis outputted in the act of outputting the state.
 20. The method of claim18, wherein, in the act of associating the one or more entity IDs, theone or more entity IDs are associated with at least one of errorinformation that is generated during processing of the respectivesubstrate storage container and process information on processing of thesubstrate stored in the respective substrate storage container, andwherein the method further comprises adjusting a control valueassociated with the processing of the respective substrate storagecontainer at the load port based on the at least one of the errorinformation and the process information for each of the one or moreentity IDs that is accumulated in the database.